Characteristics and usuage
|
Specification
|
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|
Model
|
Dimention(mm)
|
Q(cmm)
|
P(mmAq)
|
Weight(kg)
|
Effi(%)(JIS B9908 TYPE 2)
|
||
|
H
|
W
|
D
|
|||||
|
CM-FT-*
|
610
|
610
|
292
|
56
|
21
|
8.1
|
90%
|
|
CM-VP-*
|
610
|
305
|
28
|
4.8
|
|||
|
CM-HP-*
|
305
|
610
|
28
|
4.8
|
|||
|
Chemical classification
|
|||||||
|
Indication
|
Object gas
|
Gas Example
|
Semiconducter Process
|
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|
N
|
Alaklic
|
NH3
|
Photo
|
||||
|
H
|
Acdic
|
HF
|
Etching
|
||||
|
S
|
Sulfuric
|
H2S,SO2
|
Fresh Air
|
||||
|
C
|
Organic
|
TOC,TOLUNE
|
Diffusion Cleaning
|
||||
|
Efficiency
|
|||||||
|
Upper Density
|
In case of 10~30ppb
|
||||||
|
Botom Density
|
1.0ppb
|
||||||
|
Chemical Reaction Formula
|
|||||||
|
Alkalic Gas
|
NH3 + H3PO4--->(NH4)H2PO4
|
||||||
|
Acdic Gas
|
2HF + K2CO3--->CO2 + +H2O
|
||||||
|
Sulfuric Gas
|
3H2S + 2KMnO4 --->2MnO2 + 2KOH + 2H20
|
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|
Organic Gas
|
By Physical Adhesive theory
|
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