
Characteristics and usuage
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Specification
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| Chemical classification | |||
| Indication | Object gas | Gas example | Semiconductr process |
| N | Alkalic | NH3 | PHOTO |
| H | Acidic | HF | ETCHING |
| S | Sulfuric | H2S,SO2 | FRESH AIR |
| C | Organic | TOC ,TOLUENE | DIFFUSION CLEANING |
| Efficiency | |||
| Upper Density | In case of 10~30 ppb | ||
| Bottom Density | 1.0 ppb | ||
| Chemical Reation Formular | |||
| Alkalic gas | NH3+H3PO4-->(NH4)H2PO4 | ||
| Acdic gas | 2HF+K2CO3--->2KF+CO2+H2O | ||
| Sulfuric gas | 3H2S+2KMnO4--->3S+2MnO2+2KOH+2H2O | ||
| Organic gas | BY PHYSICAL ADHESIVE THEORY | ||