It is used for particle reduction as well. Early versions of wafer scrubbers proved damaging to the wafwe surface because of high pressure water sprays and nylon brushes.

However, using brushes made of polyvinyl alcohol(PVA), a soft, highly compressible, sponge-like matrial, particle removal without damage to the surface of wafers can be achived.

 

 

 

 

 

The brush scrubbers's ability to clean with room-temperature dilute solutions, non-toxic chemical and or DI water is well suited to the environmental and safety requirements to today and the even more stringent requirements of nest generation manufacturing technology.

Performance Characterristics
Property Typical Value
Apparent density 0.11
Prosity 87%
Pore size Effective pore radius of 1.4um
Tensile strength 30% compressive strength of 118 g/cm3
Absorption(DIW)Capacity // Speed 7.65mL/g //10.9cm/sec
Contamination Characteristics
Property Typical Value
Nonviolatile residue DIW extractant 0.0002g/g
Chloride 1.7ppm
Sulfate 0.2ppm
Nitrate 1.8ppm
Phosphate 2.3ppm
Sodium 0.1ppm
Potassium 0.1ppm
Particle(>0.5um) Zero stress,LPC 145,000/g
Chemical Resistance at Ambient Temperature
Acetic Acid<1% Ethy Acetate
Aceton <20% Freon
Alkali <5% Hydrohloric Acid<2%
Ammonium Hydroxide<5% Hydrofluoric Acid<10%
Benzene Isopropanol<8%
Citric Acid<5% Methanol<20%
EDTA<10% Methyl Ethyl Keton(MEK)
Ethabol<10% Phosphoric Acid<5%
Ethers Sodium Hydroxide<5%
Sulfuric Acid <5% Tolune

Feature

100% synthetic polyvinyl acetal(PVA) construction.
Tightly controlled porosity.
Precision cast and cut.
Unique finned design.
No biocide content or chemical additives.
Precision sizing and pore structure.
Cleanroom processes and packaged
E-beam sterilized.

 

 

 

 

 

 

 

Benefits

Consistent fit and function
Effective cleaning
No pre-rinsing required
Long life

 

Applications

Post-CMP process cleaning
Media cleaning
Prime siolicon wafer cleaning
Flat panel display

Specification
Brush scrubbing is considered one of the most effective methods for removing the slurry used in the CMP polishing process.
Both silicon and IC manufactures have confirmed that PVA brush scrubbing is not only able to remove particles on the order of a micron but is effective for the removal of submicron particles as well.
How is PVA brushes used in the Semiconductor and disk media industries
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W&W- Hydro cell PVA Brushes
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E-mail : bbschoi@cleandreams.com ..........Http://www.cleandreams.com
Phone : 82-2-2612-0970....... Fax : 82-2-2612-0971
805Ho 1 Dong Electronic Town, #75-1 Kochuckdong, Kurogu, Seoul, Korea

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W&W-PVA roll